AG TERMOPASTYAGT-164

AG TermoPasty AGT-164 Silver is a high-performance thermal paste with silver additives, supplied in a 1g syringe for efficient heat transfer between electronic components and heatsinks. Thermal conductivity is >3.8W/mK, making it suitable for processors, graphics cards, power electronics and other applications requiring low thermal resistance.

Technical description

AG Silver fills microscopic irregularities on mating surfaces, improving thermal coupling between the component and heatsink. It provides thermal conductivity >3.8W/mK, thermal impedance below 0.067°C in2/W and a continuous operating temperature range of approximately -50 to 250°C, with temporary resistance to higher temperatures according to manufacturer data. Its high volume resistivity makes it suitable for electronic applications requiring thermal transfer without an electrically conductive connection.

Typical applications

Suitable for CPUs, GPUs, power transistors, MOSFETs, IGBTs, power LEDs, amplifiers, power supplies and electronic components transferring heat to a heatsink or other heat-dissipation surface.

Compatibility note

This paste does not replace thermally conductive adhesive and is not intended for mechanical fixing. Apply a very thin, uniform layer to clean mating surfaces so that it fills only microscopic surface irregularities.