AG TERMOPASTYAGT-116

AG TermoPasty AGT-116 TermoGlue is a white 10g thermally conductive adhesive for permanent heatsink mounting while providing heat transfer from electronic components. It offers thermal conductivity greater than 1.0W/mK and a maximum operating temperature of up to 200°C, making it suitable where bonding and thermal coupling are required in a single material.

Technical description

TermoGlue forms a durable thermally conductive bond and is suitable for attaching heatsinks to transistors, integrated circuits and other heat-generating components. Thermal conductivity is >1.0W/mK, dielectric strength is 20kV/mm and maximum operating temperature is 200°C. Surface drying time at 25°C is approximately 2-8 hours, while complete curing may require up to 24 hours or longer depending on application thickness.

Typical applications

Suitable for mounting heatsinks on transistors, bridges and memory ICs, as well as joining and filling gaps between heat-generating elements. It is used in electronic repair, assembly and construction where mechanical heatsink mounting is impractical.

Compatibility note

The applied layer should not exceed approximately 6mm. Surfaces must be clean and dry before application, and the assembly should remain fixed until sufficient curing has been achieved.