AG TERMOPASTYPASTA-SILH-25

The AG TERMOPASTY AGT-056 PASTA-SILH-25 Thermal Conductive Silicone Paste H 25g Syringe >0.88W/mK White Non-Conductive is a silicone-based thermal compound designed to improve heat transfer between electronic components and heatsinks. It is supplied in a practical 25g syringe for controlled application and provides thermal conductivity greater than 0.88W/mK.

Technical description

AGT-056 is the 25g version of AG TermoPasty Thermal Conductive Paste H. It is a white, silicone-based, electrically non-conductive compound designed to fill microscopic surface irregularities and improve thermal coupling between an electronic component and a heatsink.

Thermal conductivity is greater than 0.88W/mK and the operating temperature range extends from -50°C to +250°C. Density at 20°C is approximately 2.58g/cm3. The syringe package allows accurate and controlled application of the required amount of thermal compound.

Indicative applications

Suitable for power transistors, MOSFETs, IGBTs, rectifiers, integrated circuits, processors, regulators, power modules, high-power LEDs, power supplies, amplifiers and other applications requiring improved heat transfer to a heatsink or other heat-dissipating metal surface.

Compatibility note

Apply the compound as a thin and uniform layer between the component and heatsink. Thermal paste does not replace insulating pads, mica sheets or other electrical insulation where the metal part of a component must be electrically isolated from the heatsink. Surfaces should be clean and dry before application.