AG TERMOPASTYPASTA CU40

AG TermoPasty PASTA CU40 is a copper-based thermal paste supplied in a 40g package, designed to improve heat transfer between electronic components and heatsinks. With a thermal conductivity of approximately 3.1W/mK, it is suitable for applications requiring improved thermal dissipation in power electronics, processors, amplifiers and cooling systems.

Technical description

PASTA CU40 fills microscopic surface irregularities between a component and its heatsink, helping reduce contact thermal resistance. Its formulation contains copper and provides thermal conductivity of approximately 3.1W/mK. The operating temperature range is approximately -50 to 250°C, and the paste is supplied in a 40g syringe for controlled application.

Typical applications

Suitable for heatsinks, power transistors, MOSFETs, IGBTs, processors, power amplifiers, converters, power supplies and other electronic applications requiring efficient thermal coupling between a component and a heatsink.

Compatibility note

Apply a thin, uniform layer to clean contact surfaces. For aluminium heatsink applications, note that the manufacturer of the current Copper range does not recommend combining copper-based paste with aluminium because of the possibility of galvanic corrosion.